The Primo HD-RIE® system is AMEC’s latest-generation dielectric etch product, launched in 2015. Based on Primo SSC AD-RIETM platform with six etch processing stations capability to maximize productivity, the tool is designed to provide comprehensive solutions for middle and high aspect ratio (HAR) structure etch. New features include: High power synchronized RF pulsing, high power and high temperature ESC, gas pulsing, multiple-zone gas distribution, cooled focus ring process kits and enhanced lid temperature control. Primo HD-RIE has superb performance in middle and high aspect ratio (HAR) etch for 3D NAND and DRAM applications. The tool has already been deployed for critical applications in mass production.
Innovative solutions for NAND and DRAM semiconductor device fabrication
Dedicated gas delivery and pumping for each processing station
Multi-zone gas feed and dual-zone ESC temperature control
High power and high temperature ESC
Gas pulsing system
Synchronized dual-level RF pulsing (bias and source) with high bias power to enhance ion energy
Stable lid temperature control
Cooled focus ring process kit option for prevention of wafer extreme-edge etch unopen
High upper/lower electrode area ratio for middle and high aspect ratio (HAR) structure etch
High dielectric material etch rate, multiple functions for etch uniformity tuning
High power synchronized dual-level RF pulsing, high ion energy to enlarge process window
Gas pulsing system with flexible process control and enlarged process window
