The Primo Twin-Star® system is AMEC’s advanced 300mm etch product based on Inductively Coupled Plasma (ICP) technology. It is a cluster tool that can be configured with up to three dual-station chambers and two optional on-board integrated strip chambers. Each dual-station chamber can process one or two wafers at the same time with highly uniform and identical results. The ICP coils employ AMEC’s proprietary low capacitive coupling 3D coil design which enables more independent ion density and ion energy control. The electrostatic chuck has multi-zones with independent and dynamic temperature settings which enhances CD control. The chamber interior is coated with high-density plasma-resistant material for more robust process repeatability and more steady productivity. The product is intended for etching Si with various CD and depths in CIS and power device, and thin conductive/dielectric films for various logic and DRAM IC devices. It has significant cost advantages compared to single-station chamber product.