Preforma Uniflex™ CW system, a 12 inch CVD metal-tungsten deposition equipment developed by AMEC independently, is high production-efficiency and excellent performance. lt can configure with up to five dual-station chambers (total 10 stations), each capable of processing two wafers simultaneously, ensuring lower production costs and chemical consumption while achieving higher production-efficiency. Preforma Uniflex™ is equipped with an optimized gas mixer with proprietary intellectual property rights, optimized shower head, pumping system and vacuum chuck with independent design. lt offers good film uniformity, good gap fill performance and process flexibility, as well as strong process handling capability for warped wafer. And its excellent step coverage and gap fill capabilities meet the requirements of W via/trench applications in advanced logic, DRAM and 3D NAND device.
Cost-effective metal-tungsten filling solution for logic and memory chip
Dual-station chamber and system can configured with up to five dual-station chambers
Independent and small reaction space
Effective and flexible process tuning window
Optimized gas mixer with proprietary intellectual property rights
Self-designed pump system with optimized gas distribution
Self-designed heater with optimized vacuum chuck
High efficiency, low cost and chemical consumption
Excellent film uniformity and gap fill capability
Excellent process adaptation and compatibility
Good process handling capability for warped wafer
